Multi-layer automatic board splitting machine

Plate thickness: 0.15-4.0


Copper thickness: 1/3~4oz


产品详情

Multi-layer board automatic splicing machine is a kind of automatic laminate board splicing equipment: circuit board (PCB) in the multi-layer pressing process, in order to increase the output of multi-plate pressing, this machine can effectively replace manual work, through the imaging system algorithm, automatic edge finding, identification of product splicing center line, through the central control system to achieve automatic disassembly, automatic edge cutting and recycling, effectively improve productivity; With air cooling system, the effect of natural cooling of the laminate (PCB) to room temperature is more in line with the post-process operation.

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