1. Line and Pattern: The line is used as a tool for conducting between the originals, and a large copper surface will be designed as a grounding and power layer in addition. The lines and drawings were made simultaneously.

2. Holes (Throughhole/via) : The throughhole can enable lines at more than two levels to pass through each other, the larger throughhole is used as a part plug-in, and the non-throughhole (nPTH) is usually used as a surface mount positioning, and is used to fix screws during assembly.

Industrial control board

3. The welding (Solderresistant/SolderMask ink) : not all the copper surface to solder on the parts, so the solder area, can print solder material cut off a layer of copper surface (usually) of epoxy resin, avoid the solder short circuit between the lines. According to different processes, it is divided into green oil, red oil and blue oil.

4 Dielectric layer (Dielectric) : used to maintain the insulation between the line and the layers, commonly known as the substrate.

5. Screen printing (Legend/Marking/Silkscreen) : this is a necessary composition, main function is in the circuit board on the parts name, location, box, convenient maintenance and identification after assembly.

6. Surface treatment (SurfaceFinish) : Because the copper surface is easily oxidized in the general environment, it can not be tinned (poor solderability), so it will protect the copper surface to eat tin. The way of protection is to spray TIn (HASL), gold (ENIG), silver (ImmersionSilver), tin (Immersion TIn), organic flux (OSP), the method has advantages and disadvantages, collectively referred to as surface treatment.